Hexagonal Boron Nitride CAS 10043-11-5

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Description

Hexagonal Boron Nitride CAS 10043-11-5

Formula: BN

CAS No.: 10043-11-5

Hexagonal Boron Nitride is a smooth soft powder in white color. Its microstructure is single platelet with hexagonal crystal system. It provides perfect electric insulation, thermal conductivity, lubricity as well as chemical resistance. It is chemical inert material; almost stable to all the organic solvent, melting metal and corrosive chemicals.

We can offer to you Boron Nitride in following qualities:

Hexagonal Boron Nitride Grade HSL/HS

Hexagonal Boron Nitride Grade HN

Hexagonal Boron Nitride Grade HC/HC-W

Hexagonal Boron Nitride Grade HF

More products biolla/INNOVOX: Product list

Boron Nitride HSL/HS

Hexagonal Boron Nitride HSL/HS

CAS 10043-11-5

Grade	Purity	B₂O₃	Tot. Oxygen	Avg. Particle Size (D₅₀)	Crystal Size	Tap Density	Surface Area (BET)
HSL	99.4%	0.05%	0.4%	35 µm	35 µm	0.6 g/cm³	2 m²/g
HS	99.4%	0.05%	0.4%	20 µm	20 µm	0.6 g/cm³	2 m²/g

Application:

As additive for polymers such as PA and PE to increase thermal conductivity
As additive for thermal interface materials to enhance the thermal conductivity
As additive to color cosmetics, to enhance skin feel and optical pearl effect
As raw material for high temperature insulation composite material
As additive to premium lubricant oil
As release agent in optical glass production process

Characteristics Boron Nitride HSL/HS

These two grades are produced at temperatures up to 2,100°C. They have single platelet microstructure and high crystallinity. Due to the process control, the crystals grow significantly which results in large platelet size. Those powders are equivalent to the products available in the market place.

Over the last couple of years the density of electronic packaging has increased significantly. Due to the miniaturization and the elevation of the specific power the electronic components are faced with high thermal energy output. This requires the development of thermal conductivity polymers. Very good examples are LED, small electronic terminal equipment and automotive engine control units as well as battery technology. Base Polymers typically used in those applications offer thermal conductivities in the range of 0.1 to 0.4 W/mK. In order to adjust the thermal conductivity of a polymer, functional fillers have to be added. Boron Nitride is the perfect choice, since it offers the highest levels of thermal conductivity (400W/mK) of any other dielectric and non-toxic filler. Resulting compounds with Grade HSL and HS can reach levels over 10 W/mK depending on the loading and the morphology of the Boron Nitride powder.
High crystallinity h-BN typically allows higher thermal conductivity, electrical insulation, lubricity, high temperature resistance and anti-corrosion against melting metal than common products. They can be used in any kinds of high-end field which cosmetics and thermal conductivity application are included.

Boron Nitride HN

Hexagonal Boron Nitride HN

CAS 10043-11-5

Purity	B₂O₃	Total Oxygen	Avg. Particle Size (D₅₀)	Crystal Size	Tap Density	Surface Area (BET)
99.4%	0.05%	0.4%	10 µm	10 µm	0.3 g/cm³	10 m²/g

Application:

As filler in thermal conductivity products
As raw material for BN coating in plasma spray
As principal raw material in BN coating
As principal raw material at high temperature insulation composite
As release agent in optical glass production process
As additive in premium lubricant oil
As raw material in hot pressed BN products

Characteristics of Boron Nitride HN

Grade HN is produced up to 1800°C. It has single platelet microstructure and high crystallinity. Those platelets have an average size of app. 9µm and a high aspect ratio. The product is matching the quality of competitive materials manufactured in other parts of the world and can be used as a 1:1 replacement in a lot of established applications. Furthermore, Grade HN has uniform particle size and the particle size is similar to PTFE. Hence it is the perfect additive to be used in high voltage switch nozzle process. Due to its high thermal conductivity, it is a very good fit for thermal conductivity polymer and rubber application. Also very good for high-end BN hot pressed parts with lower oxygen content which is usually less than 0.5%.

Boron Nitride HC/HC-W

Hexagonal Boron Nitride HC/HC-W

CAS 10043-11-5

rade	Purity	B₂O₃	Tot. Oxygen	Avg. Particle Size (D₅₀)	Crystal Size	Tap Density	Surface Area (BET)
HC	99%	0.4%	0.5%	9 µm	6 µm	0.3 g/cm³	18 m²/g
HC-W	99.3%	0.1%	0.4%	9 µm	6 µm	0.3 g/cm³	18 m²/g

Application:

To produce special composite ceramic such as Evaporation Boat
As the raw material for hot pressed BN
As additive of lubricant coating
As additive of metal surface treatment
To produce Cubic Boron Nitride
As the release agent in shape casting or injection molding process
As additive in high temperature lubricant oil

Characteristics Boron Nitride HC/HC-W:

Grade HC is a medium crystal sized with good high temperature resistance and oxidation resistance performance. The crystal size is smaller and some agglomerate to particles with larger size. Due to its round partial agglomerate particle shape, it is very suitable for the application of filler or release agent in shape casting and injection molding process. It is also used to produce composite ceramic and hot pressed BN parts.
Grade HC-W has lower B₂O₃ content, so it is the perfect choice for the applications that request lower B₂O₃ contents.

Boron Nitride HF

Hexagonal Boron Nitride HF

CAS 10043-11-5

Purity	B₂O₃	Total Oxygen	Avg. Particle Size (D₅₀)	Crystal Size	Tap Density	Surface Area (BET)
99%	0.1%	0.7%	4 µm	1 µm	0.3 g/cm³	16 m²/g

Application:

As additive for thermal conductivity tape and film
As additive of thermal conductivity fiber product
As raw material for h-BN coating
As release agent
To produce Cubic Boron Nitride
As raw material of special ceramic

Charactericstics Boron Nitride HF

With smaller particle size, higher crystallinity, higher purity and lower B₂O₃ level it is suitable for the application that requests smaller particle size.

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